Use:

 The surface of the circuit board is activated to improve the bonding force between the hole wall and the copper plating layer

 Chemical immersion gold, finger and pad surface cleaning before plating

 Surface roughening and activation of silica gel, plastic, polymer

 Circuit board through hole, blind hole, buried hole degreasing

 Surface roughening and cleaning of electronic materials

Features:

 Horizontal electrode design can meet the processing needs of soft products

 Reasonable plasma reaction space makes the processing more uniform

 Integrated control system design, easy to operate

 Good safety, multi-functional safety protection

 Low energy and gas consumption products

Use range:

 Circuit board industry, LED photoelectric industry, semiconductor IC industry, mobile phone manufacturing industry, silicone, plastic, polymer industry, solar photovoltaic industry